The cold-rolled Cu/Al laminated composite was annealed at 475-525℃ for 1-8min, the temperature field of Cu/Al composite during annealing was simulated using finite element software, and the microstructures and properties of Cu/Al composite were investigated by scanning electron microscopy(SEM), energy dispersive X-ray spectrometry(EDS), X-ray diffractometer(XRD), electron back-scattered diffraction(EBSD) and microhardness tester. The results indicated that three intermetallic compounds (IMCs), CuAl<sub>2</sub> ,Cu<sub>9</sub>Al<sub>4</sub> and CuAl phases formed successively at the Cu/Al interface, complete recrystallization of both the Cu and Al matrix took place to form equixed grain, within the annealing process scope in which the thickness of IMCs layer is smaller than 4μm, the microhardness of Cu and Al matrix drops fast to approach that of annealing at 350℃ for 1h.Therefore, the high-temperature short-time annealing process could substitute for low-temperature long-time annealing process. Furthermore,the nucleation mechanism of primary phase was proposed and the kinetics of IMCs during high-temperature short-time was analytized and calculated, and an empirical numerical method was proposed to calculate the thickness of IMCs during the non-isothermal annealing process.