Hot dip plating is used to prepare Pb40Sn60 alloy coatings on copper wires to improve the properties of weldability and corrosion resistance, the microstructure and phase composition of Pb40Sn60 alloy coating under different hot dip plating rates were examined by scanning electron microscopy (SEM) and energy dispersive spectrometry (EDS) and X-ray diffraction (XRD). and the mechanical properties of Cu wires with Pb40Sn60 alloy coating under different hot dip plating rates were investigated by the tensile test. The results show that the Pb40Sn60 alloy coatings are all composed of α phase and β phase, and the relative amount of α phase is more than β phase. With the increase of hot dip plating rate, the thickness of Pb40Sn60 alloy coating on copper wire are thickened, and the crystal morphology is change from lamellar or equiaxial to dendritic. The work hardening of copper wires can be eliminated during the hot dip plating process. With the decrease of hot dip plating rate, the strength of copper wires with Pb40Sn60 alloy coating is decrease significantly, and the elongation is not obvious change, the hardness of copper wires substrate shows a slightly decreasing trend, and the hardness of coating shows a slightly decreasing trend. There is beneficial to the crystallization and growth of the coating by increasing the rate of hot dip plating, on the contrary, there is beneficial to remove the work hardening of copper wire substrate by reducing the rate of hot dip plating.