Wang Wensen
Aeronautical Key Laboratory for Welding and Joining Technologies,AVIC Manufacturing Technology InstituteLi Xiaohong
Aeronautical Key Laboratory for Welding and Joining Technologies,AVIC Manufacturing Technology InstituteDeng Yunhua
Aeronautical Key Laboratory for Welding and Joining Technologies,AVIC Manufacturing Technology InstituteYue Xishan
Aeronautical Key Laboratory for Welding and Joining Technologies,AVIC Manufacturing Technology InstituteAeronautical Key Laboratory for Welding and Joining Technologies,AVIC Manufacturing Technology Institute
TG306
[Wang Wensen, Li Xiaohong, Deng Yunhua, Yue Xishan. Study on High Temperature Creep Forming Process of TC4 Titanium Lotus Seedpod-like Core[J]. Rare Metal Materials and Engineering,2020,49(9):3244~3250.]
DOI:10.12442/j. issn.1002-185X.20190774