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Formation and Thermal Stress Analysis of Oxide scale of Interconnects Alloy in SOFC Reduction Atmosphere
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1.China University of Geosciences;2.Wuhan Institute of Technology

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Fund Project:

National Natural Science Foundation of China

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    Abstract:

    In this paper, the high temperature oxidation behavior of a new metal interconnects material Fe-Cr-Co alloy in SOFC anodic atmosphere (N2+2%H2+60%H2O) was studied by cyclic oxidation at 750C, and then the thermal stress analysis was carried out based on the interface morphology of the real oxide and the alloy. The phase structure, cross-sectional morphology and composition of the alloy oxide were characterized by X-ray diffractometer (XRD) and field emission electron microscope (SEM) equipped with energy spectrometer (EDS), and the thermal stress extreme distribution of the alloy oxide was simulated by image processing and finite element simulation technology. The characterization results show that 2 μ m oxide is formed by cyclic oxidation of Fe-Cr-Co alloy in 750C anode for 600h, which is composed of Fe-doped Cr2O3 inner layer and MnCr2O4 outer layer, and the simulation analysis shows that the maximum shear stress at the interface is distributed in the region between the peak and trough, which makes the oxide in this area easy to peel off first.

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[Miao Zhongyi, Chen Lin, Zhang Wenying, Xiong Chunyan. Formation and Thermal Stress Analysis of Oxide scale of Interconnects Alloy in SOFC Reduction Atmosphere[J]. Rare Metal Materials and Engineering,2021,50(6):2069~2074.]
DOI:10.12442/j. issn.1002-185X.20200547

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History
  • Received:July 27,2020
  • Revised:August 27,2020
  • Adopted:September 02,2020
  • Online: July 07,2021
  • Published: June 30,2021