A new way to add Sc in Al alloys using Cu-Sc master alloy was developed. The dissolution behaviors of Cu-Sc master alloy in liquid Al was investigated in this paper. It is was found that the size and areal fraction of particles bearing Sc decrease, the solid solution content of Sc in α Al after solidification increases with increase in holding time and temperature. The grain size of solidified ingots is finer in short holding time. While it increases with increase in holding time and temperature, which is resulted form reduction in the size and areal fraction of particle bearing Sc during dissolution.