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Effect of Cooling Rate on Solidification Microstructure and Properties of Al-Cu Binary Alloy
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1.Key Lab of Electromagnetic Processing of Materials, Ministry of Education, Northeastern University, Shenyang 110819, China;2.Advanced Manufacturing Technology and Engineering Research Centers, Northeastern University, Shenyang 110819, China

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Fundamental Research Funds for the National Natural Science Foundation of China (U1708251); Key Research and Development Program of Liaoning (2020JH2/10700003); Liaoning Revitalization Talents Program, China (XLYC1807027); Fundamental Research Funds for the Central Universities (N2109004)

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    Abstract:

    To investigate the influence of cooling rate on the solidification structure of Al-Cu binary alloy, the ingot of Al-6%Cu alloy was produced by the wedge-shaped copper mode casting. The results indicate that when the cooling rate decreases from 100 K/s to 2 K/s, the grain morphology transformation of ingot is as follows: columnar grains→mixing of columnar grains with equiaxed grains→equiaxed grains. Meanwhile, the width of columnar crystal at the ingot edge increases from 244.7 μm to 408.2 μm, the average grain size of equiaxed crystal at the ingot core decreases from 629.8 μm to 152.8 μm, and the average dendrite arm spacing increases from 10.1 μm to 52.8 μm. The parameters A and n of Al-6%Cu alloy in the empirical formula of average dendrite arm spacing and cooling rate are 78.75 and 0.41, respectively. When the cooling rate decreases from 100 K/s to 25 K/s, the morphology of eutectic Al2Cu changes from skeletal to lamellar, and α-Al near the eutectic Al2Cu is cellular. With the cooling rate increases from 2 K/s to 100 K/s, the hardness of Al-6%Cu alloy is increased from 618 MPa to 726 MPa.

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[Wang Xiangjie, Yang Lingfei, Tan Hongjuan, Yu Fang, Cui Jianzhong. Effect of Cooling Rate on Solidification Microstructure and Properties of Al-Cu Binary Alloy[J]. Rare Metal Materials and Engineering,2022,51(6):2033~2038.]
DOI:10.12442/j. issn.1002-185X.20210395

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History
  • Received:May 05,2021
  • Revised:July 08,2021
  • Adopted:August 05,2021
  • Online: June 29,2022
  • Published: June 29,2022