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Effect of Substrate Surface Morphology on Thermal Spraying and Bonding Strength of Ni/Fe via Atomistic Simulation
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1.School of Mechanical and Electronical Engineering, Lanzhou University of Technology, Lanzhou 730050, China;2.Key Laboratory of Digital Manufacturing Technology and Application, Ministry of Education, Lanzhou University of Technology, Lanzhou 730050, China

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Fund Project:

National Natural Science Foundation of China (52065036); Natural Science Foundation of Gansu Province (20JR5RA448); Hongliu First-Class Disciplines Development Program of Lanzhou University of Technology

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    Abstract:

    The molecular dynamics method was applied to simulate the effects of substrate surface morphology on nano-thermal spraying. The effects of columnar rough surface and smooth surface on cluster flattening, defect evolution of substrate, stress distribution, and the bonding strength between coating and substrate were investigated. The results show that the substrate surface morphology has a significant effect on the bonding strength of thermal spraying. The rough surface increases the actual contact area between the clusters and the matrix, improves the adhesion, causes the anchorage effect at the interface, and thereby enhances the bonding strength. In addition, the substrate surface morphology can change the stress distribution in the interface region. The columnar rough surface on the matrix weakens the stress concentration effect, decreases the critical stress, and reduces the damage to the substrate. Besides, the rough surface hinders the cluster slip and reduces the flattening ratio.

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[Lei Chunli, Dong Jianyong, Yang Shengze, Cao Hui, Zhang Jun, Li Haiyan, Feng Ruicheng. Effect of Substrate Surface Morphology on Thermal Spraying and Bonding Strength of Ni/Fe via Atomistic Simulation[J]. Rare Metal Materials and Engineering,2022,51(3):881~887.]
DOI:10.12442/j. issn.1002-185X.20210616

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History
  • Received:July 13,2021
  • Revised:October 20,2021
  • Adopted:October 27,2021
  • Online: March 30,2022
  • Published: March 30,2022