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Home > Archive>Volume 52, Issue 2, 2023 >502-507. DOI:10.12442/j.issn.1002-185X.20220645
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Effect of Ag Content on Formation and Growth of Inter-metallic Compounds in Sn-20Bi-0.7Cu Solder
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Affiliation:

1.Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093, China;2.Tin Products Manufacturing Co., Ltd of YTCL, Kunming 650217, China;3.R&D Center, Yunnan Tin Group (Holding) Co., Ltd, Kunming 650000, China;4.School of Engineering, Southwest Petroleum University, Nanchong 637001, China

Fund Project:

Major Science and Technology Project in Yunnan Province-New Material Special Project (202105AE160028); Yunnan Province Transformation Research Institute Technology Development Research Project-Innovation Guidance and Technology Enterprise Cultivation Plan (202202AB080001);Fundamental Research and Applied Basic Research Enterprise Joint Project Between Yunnan Provincial Department of Science and Technology and Yunnan Tin Group (Holding) Company Limited (202101BC070001-010)

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    Abstract:

    The interfacial reactions and growth kinetics of Sn-20Bi-0.7Cu-xAg (x=0.1, 0.4, 0.7, 1.0, 1.5, wt%) were investigated during solid-state aging. The effects of chemical composition on the structure and the growth of interface under high temperature and high humidity conditions were studied experimentally and numerically. In order to determine the long-term reliability of the solder joints, thermal accelerated aging tests were performed for 0, 10, 30, 50, 100, 200 and 500 h under 85 °C and 85% relative humidity conditions. The surface morphology, thickness, and distribution of interface compounds were observed by scanning electron microscope. The nucleation surface and growth direction of β-Sn were clarified. The phases were determined at the interface and the alloy matrix. Results show that with increasing the Ag content, the growth of the Cu6Sn5 layer is suppressed. The growth kinetics of intermetallic compound (Cu6Sn5+Cu3Sn) remains a diffusion-controlled process during the isothermal aging. The scallop-type Cu6Sn5 phase disappears at later aging stages, suggesting that the growth mechanism changes to the steady growth in the direction perpendicular to the interface. Besides, the results reveal that Ag3Sn effectively slows down the growth kinetics of Cu6Sn5.

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[Chen Dongdong, Qin Junhu, Gan Youwei, Zhang Xin, Bai Hailong, Zhao Lingyan, Yi Jianhong, Yan Jikang. Effect of Ag Content on Formation and Growth of Inter-metallic Compounds in Sn-20Bi-0.7Cu Solder[J]. Rare Metal Materials and Engineering,2023,52(2):502~507.]
DOI：10.12442/j. issn.1002-185X.20220645

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History
  • Received:August 08,2022
  • Revised:October 26,2022
  • Adopted:November 09,2022
  • Online: March 03,2023
  • Published: February 28,2023

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