For the creep behavior of lead-free solders and solder joints in recent years, the creep deformation behavior and its application in reliability of solder joint were reviewed. Firstly, the creep behavior of lead-free solders was systematically introduced, and the creep modification mechanism of lead-free solders bearing alloying elements or particles was discussed. Secondly, the creep behavior of solder joints was reviewed, and the research progress about the influence of solder joint composition and substrate materials on the creep behavior of solder joints was analyzed. Furthermore, for specific electronic devices, the creep response and fatigue life prediction of solder joints based on finite element method were analyzed by using finite element simulation, and the reliability of solder joints was evaluated. Finally, the future development of lead-free solder and solder joint creep behavior is prospected, and the existing problems and solutions are analyzed to provide theoretical support for further research on solder joint reliability.