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Preparation and Brazing Performance of Low-Silver SnAgCu Composite Solder Reinforced by Nickel Coated Al2O3
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1.Henan University of Science and Technology, Luoyang 471000, China;2.Luoyang Institute of Science and Technology, Luoyang 471023, China

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National Natural Science Foundation of China (U1604132); Central Plains Talents Program-Fund of Central Plains Leading Talents (ZYYCYU002130); Key Technology Research and Development Program of Henan Province (222102230114); Major Scientific Research Foundation of Higher Education of Henan Province (23B430003)

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    Abstract:

    Dopamine polymerization reaction and hydrothermal method were used to prepare nickel coated Al2O3 reinforcement phase (Ni/Al2O3). Ni/Al2O3 reinforced Sn1.0Ag0.5Cu (SAC105) composite solder was prepared using traditional casting method. The result shows that the nickel coating layer is continuous with uneven thickness. The interface between nickel and aluminum oxide exhibits a metallurgical bonding with coherent interface relationship. The strength, toughness and wettability of the SAC105 solder on the substrate are improved, while the conductivity is not decreased significantly. The fracture mode of composites transitions from a mixed toughness-brittleness mode to a purely toughness-dominated mode, characterized by many dimples. The prepared composite brazing material was made into solder paste for copper plate lap joint experiments. The maximum shear strength is achieved when the doping amount was 0.3wt%. The growth index of intermetallic compound at the brazing interface of Ni/Al2O3 reinforced SAC105 composite solder is linearly fitted to n=0.39, demonstrating that the growth of intermetallic compound at the interface is a combined effect of grain boundary diffusion and bulk diffusion.

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[Wang Bingying, Zhang Keke, Fan Yuchun, Wu Jinna, Guo Limeng, Wang Huigai, Wang Nannan. Preparation and Brazing Performance of Low-Silver SnAgCu Composite Solder Reinforced by Nickel Coated Al2O3[J]. Rare Metal Materials and Engineering,2025,54(4):854~861.]
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History
  • Received:March 17,2024
  • Revised:March 23,2025
  • Adopted:May 20,2024
  • Online: April 23,2025
  • Published: April 21,2025