The hot deformation behavior of electrolytic copper was investigated using a Gleeble-3500 thermal simulation testing machine at temperatures ranging from 500 °C to 800 °C and strain rates ranging from 0.01 s^-1 to 10 s^-1, under 70% deformation conditions. The true stress-true strain curves were analyzed and a constitutive equation was established at a strain of 0.5. Based on the dynamic material model proposed by Prasad, processing maps were developed under different strain conditions. Microstructure of compressed sample was observed by electron backscatter diffraction. The results reveal that the electrolytic copper demonstrates high sensitivity to deformation temperature and strain rate during high-temperature plastic deformation. The flow stress decreases gradually with raising the temperature and reducing the strain rate. According to the established processing map, the optimal processing conditions are determined as follows: deformation temperatures of 600–650 °C and strain rates of 5–10 s^-1. Discontinuous dynamic recrystallization of electrolytic copper occurs during high-temperature plastic deformation, and the grains are significantly refined at low temperature and high strain rate conditions.