1.South China University of Technology;2.Guangzhou Leijia Additive Technology Co., Ltd
National Key Research and Development Program of China(No. 2024YFB4608600); The Science and Technology Planning Project of Guangdong Province (No. 2018B090905002)
[Lv Shaobo, Yang Yongqiang, Wang Di, Liu Linqing, Wu Shibiao, Zhang Shiqin, Jiang Fei. Research on the mechanism of pure copper binder jetting additive forming and sintering densification[J]. Rare Metal Materials and Engineering,,().]
DOI:10.12442/j. issn.1002-185X.20240835