Microstructure and Diffusion Mechanism of CoCrCuFeNi HEA Joints Diffusion Welded Using Co Filler

doi:10.12442/j.issn.1002-185X.E20220028

Home > Archive>Volume 52, Issue 4, 2023 >1176-1183. DOI:10.12442/j.issn.1002-185X.E20220028

Microstructure and Diffusion Mechanism of CoCrCuFeNi HEA Joints Diffusion Welded Using Co Filler
DOI:
                        10.12442/j.issn.1002-185X.E20220028
                    
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Affiliation:1.Key Laboratory of Light Metal Materials Processing Technology of Guizhou Province, Guizhou Institute of Technology, Guiyang 550003 China;2.Department of Materials & Energy Engineering, Guizhou Institute of Technology, Guiyang 550003, China;3.Special Functional Materials Collaborative Innovation Center of Guizhou Province, Guizhou Institute of Technology, Guiyang 550003, China
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Fund Project:Guizhou Province Science and Technology Planning Project (Qianke He Jichu ZK[2022] Yiban 175); National Natural Science Foundation of China (51964011); Education Department Youth Science and Technology Talent Growth Project of Guizhou Province (Qian Jiao He KY [2022] 342); Special Project for Cultivation and Innovation Exploration of New Academic Talents of Guizhou Institute of Technology (GZLGXM-13); High Level Talent Program of Guizhou Institute of Technology (XJGC20190916); Guzhou Province High Level Innovative Talents (Qianke He Platform and Talent (2022) 011-1); Guzhou Colleges and Universities Process Industry New Process Engineering Research Center (QianJiaoJi (2022)034)

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Abstract:

A CoCrCuFeNi high-entropy alloy (HEA) was diffusion welded using a Co filler at 850, 950, 1050, and 1100 °C, and the microstructure and diffusion mechanism of the joints were examined. Results show that firm connections are achieved at each temperature, no intermetallic compound forms in the joints, and some Kirkendall voids are remained on the HEA side around the interface. The diffusion coefficients of Cr, Fe, Ni, and Cu in the Co filler at 850 and 950 °C are calculated, ranked as follows: Cu>Cr>Fe>Ni. The diffusion rates of all elements are at the same level. The diffusion between the CoCrCuFeNi HEA and Co filler occurs under the combined action of the vacancy and grain boundary diffusion mechanisms.

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[Li Juan, Luo Shaomin, Zhao Honglong, Zhou Nian, Qin Qingdong. Microstructure and Diffusion Mechanism of CoCrCuFeNi HEA Joints Diffusion Welded Using Co Filler[J]. Rare Metal Materials and Engineering,2023,52(4):1176~1183.]
DOI：10.12442/j. issn.1002-185X. E20220028

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Received:October 09,2022
Revised:April 04,2023
Adopted:January 05,2023
Online: April 28,2023
Published: April 25,2023

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