The wettability and interface bonding mechanism between 55% SiCp/Al composite materials and PbO-ZnO-B2O3 glass during the sealing process were investigated in this article. The results showed that the glass would spread wider with the increase of temperatures. That is to say the wettability angle became smaller and the wettability was improved. The spreading area of glass on Al2O3 and SiC were larger and the wettability angles were smaller than those on the composites. The sealing temperature between glasses and 55% SiCp/6061Al range from 450~490 ℃. When the sealing temperature is higher than 470 ℃, bubbles would appear in the sealing interface and the number of bubbles increased with the increasing of temperatures, at the same time the size of the bubbles would became larger too. When the sealing temperature is 460 ℃, a 12 μm diffusion region appeared between the glass and 55% SiC/Al composites. When the sealing temperature is 490 ℃, there was a clear boundary between the glass and Al2O3 ceramic, and the SiC particles would diffuse into the glass when the glass and SiC ceramic were sealed together.