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Investigation of Partial Silver-Piating in Electronic Packaging
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TQ153.1

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    Abstract:

    A photolithograph technology is used to fabricate patterned fine lead frame, and the factor of partial silver-plating is discussed. We find the pretreatment and electroplating technology is the key of plating layer quality: 1, current density can influence the roughness of silver plating surface, if it is 0.5 A/dm2, we can get the smooth silver plating; 2, electroplating time also plays an important role in controlling plating thickness, we can gain the even silver plating after 12 min-16 min plating.

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[Ning Honglong, Huang Fuxiang, Ma Jusheng, Geng Zhiting, Huang Hui, Lu Chao. Investigation of Partial Silver-Piating in Electronic Packaging[J]. Rare Metal Materials and Engineering,2004,33(2):176~178.]
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  • Received:
  • Revised:July 01,2002
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