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Formation of GaN Film by Ammoniating Ga2O3/Al2O3 Deposited on Si(111) Substrate
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TN304

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    Abstract:

    Gallium nitride (GaN) films have been successfully fabricated on silicon (111) substrates through ammoniating Ga2O3/Al2O3 films deposited by rf magnetron sputtering. The formed films were characterized by Fourier transform infrared (FTIR) transmission spectroscopy, X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS) , scanning electron microscopy (SEM) and photoluminescence spectrum(PL). The results indicate that the films formed are polycrystalline GaN with hexagonal wurtzite structure.

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[Wei Qinqin, Xue Chengshan, Sun Zhencui, Cao Wentian, Zhuang Huizhao. Formation of GaN Film by Ammoniating Ga2O3/Al2O3 Deposited on Si(111) Substrate[J]. Rare Metal Materials and Engineering,2005,34(2):312~315.]
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  • Received:
  • Revised:May 28,2003
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