Effect of Ag and Ni Fine Particles on Mechanical Properties of SnPb Composite Solder

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Effect of Ag and Ni Fine Particles on Mechanical Properties of SnPb Composite Solder
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                        Yan Yanfu,Liu Jianping,Shi Yaowu,Xia ZhidongYan Yanfu,Liu Jianping,Shi Yaowu,Xia Zhidong

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Key words:Sn-Pb solder,particles enhanced,mechanical properties,composite solders

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[1]Yan Yanfu,Liu Jianping,Shi Yaowu,Xia Zhidong.Effect of Ag and Ni Fine Particles on Mechanical Properties of SnPb Composite Solder[J].Rare Metal Materials and Engineering,2005,34(4):622-626.

[2]YAN Yan-fu,LIU Jian-ping,SHI Yao-wu and XIA Zhi-dong.Effect of Ag and Ni particles on mechanical properties and wettability of SnPb composite solder[J].Transactions of The China Welding Institution,2004,25(1):65-70.

[3]WANG Da-yong,GU Xiao-long.Effect of Ni on the Microstructures and Mechanical Properties of Sn- 0.7Cu Lead- free Solder[J].Electronics Process Technology,2007,28(1):17-19.

[4]LI Chenyang,ZHANG Keke,WANG Yaoli,ZHAO Kai and DU Yile.Effect of Ni on interfacial IMC and mechanical properties of Sn2.5Ag0.7Cu0.1RE/Cu solder joints[J].Transactions of The China Welding Institution,2012,33(11):39-42.

[5]Effect of Ni on Microstructure and Properties of Sn2.5Ag0.7Cu Solder Alloy[J].Foundry Technology

[6]YAN Yan - Fu,LIU Jian - ping,Sffl Yao - wu,XIA Zhi - dong,ZHOU Guo - feng.Effect of Enhanced Particles Cu on Creep Rupture Life of SnPb Based Composite Solder[J].Electronics Process Technology,2004,25(1):20-22.

[7]WANG Wenli,YAN Yanfu.Effects of Ni on Mechanical Property and Microstructure of BiSbSn Solder Alloy[J].Hot Working Technology,2013,42(13).

[8]ZHANG Cui-cui.Effects of Pb on Properties of Sn3.5Ag0.5Cu Alloy Solder[J].Journal of Liaoning University of Petroleum & Chemical Technology,2009,29(4):4.

[9]Szu-Tsung Kao,Jenq-Gong Duh.Effect of Cu concentration on morphology of Sn-Ag-Cu solders by mechanical alloying[J].Journal of Electronic Materials,2004,33(12):1445-1451.

[10]Cheng;Guanghui;Zhang;Keke;Man;Hua;Yang;Jie;Liu;Yamin;Yu;Yangchun.Effect of Rare Earths on Microstructure and Properties of Sn2.0Ag0.7CuRE Solder Alloy for Surface Mount Technology[J].Journal of Rare Earths,2005,23(4):I0009-I0009.

[11]Tai Feng,Ma Limin,Guo Fu,Shi Yaowu.Effects of Isothermal Aging on the Microstructure and Mechanical Properties of Particle-Reinforced Composite Solder Joints[J].Rare Metal Materials and Engineering,2010,39(Z1).

[12]ZHANG Xinping,YU Chuanbao,ZHANG Yupeng and ZHU Min.Creep-resistant performance of two lead-free solders and comparison with Sn60Pb40 solder[J].Transactions of The China Welding Institution,2007,28(2):1-4.

[13]Tang Qinghua,Pan Xiaoguang,Lawrance C.M.Wu.Effect of Annealing on Intermetallic Cu-Sn of 96.5Sn3.5Ag Solder Joint[J].Electronics Process Technology,1999,20(3):106-108.

[14]LIU Jian-ping,YAN Yan-fu,GUO Fu-et al..Study on nanon-sized Ag particles enhanced composite solder[J].Welding Technology,2004,33(4):38-40.

[15]F. Guo,J. Lee,J. P. Lucas,K. N. Subramanian,T. R. Bieler.Creep properties of eutectic Sn-3.5Ag solder joints reinforced with mechanically incorporated Ni particles[J].Journal of Electronic Materials,2001,30(9):1222-1227.

[16]M. Mccormack,H. S. Chen,G. W. Kammlott,S. Jin.Significantly Improved Mechanical Properties of Bi- Sn Solder Alloys by Ag- Doping[J].Journal of Electronic Materials,1997,26(8):954-958.

[17]Zhang Keke,Guo Xingdong and Wang Huigai.Interfacial Microstructure and Mechanical Properties of Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu Solder Joint under Thermal Shock[J].Rare Metal Materials and Engineering,2017,46(5):1353-1358.

[18]Enhanced ductility and mechanical strength of Ni-doped Sn–3.0Ag–0.5Cu lead-free solders[J].Materials & Design

[19]Yang Bangchao,Su hong,Ren Hui.The Research of the Lead-free Solder for Mechanical Properties[J].Printed Circuit Information,2005,40(7):54-57.

[20]Yaowu Shi,Yanfu Yan,Jianping Liu,Zhidong Xia,Yongping Lei,Fu Guo,Xiaoyan Li.Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles[J].Journal of Electronic Materials,2009,38(9):1866-1873.

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[Yan Yanfu, Liu Jianping, Shi Yaowu, Xia Zhidong. Effect of Ag and Ni Fine Particles on Mechanical Properties of SnPb Composite Solder[J]. Rare Metal Materials and Engineering,2005,34(4):622~626.]
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