It is well known that direct copper plating on ABS plastics has found widely industrial application for eliminating plating. The Pd/Sn colloids for direct copper plating have better dispersivity and smaller size than the colloids for electroless electroless Ultraviolet-visible absorption spectrometry, nanophox, and stereoscopic microscopy were used to characterize the colloids. The good dispersivity colloids have excellent catalysis for direct copper plating and its UV-VIS peaks are broadened. In order to enhance the dispersivity and minimize the particle size, vanillin was added to colloids solution in the present investigation.