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Microstructure and Properties of High Strength and High Conductivity Cu-Nb Microcomposite
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    Abstract:

    Cu-Nb microcomposite wire materials containing N=854 niobium filaments were prepared by bundling and drawing technique. The electrical resistivity of the materials is 0.36 μΩ·cm at 77 K. The conductivity values could be greater than 70%IACS at 293 K. The ultimate tensile strength could reach 915 MPa at room temperature when the sectional area of the materials was larger than 5 mm2. And the fracture surface morphology and the Nb filaments arrangement of Cu-Nb wires were observed by SEM.

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[Liang Ming, Chen Zili, Lu Yafeng, Li Chenshan, Yan Guo, Li Jinshan, Zhang Pingxiang. Microstructure and Properties of High Strength and High Conductivity Cu-Nb Microcomposite[J]. Rare Metal Materials and Engineering,2009,38(10):1774~1777.]
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  • Received:February 25,2009
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