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Deposition Mechanism of Eletroless Plating of Ni-P on AZ91D Magnesium Alloy
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    Abstract:

    The deposition process of electroless plating of Ni-P on AZ91D magnesium alloy was investigated by metallographic microscope, scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). Results show that the initial deposition mechanisms of Ni-P coating in different places of the activated surface are different. There is only nickel (Ni) deposition but no P on “massive object” generated after activation, mainly due to the dissolution of the fluorides and the replacement of Mg for Ni. For β phase and the edge of α phase, adjacent Ni2+ would gain a few electrons lost by Mg and be reduced because of electrochemical effect. The Ni nucleus with high catalytic activity provides the catalysis condition for the reduction of P and Ni.

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[Qian Jiangang, Teng Xiaoming, Liu Yufen, Huang Wei. Deposition Mechanism of Eletroless Plating of Ni-P on AZ91D Magnesium Alloy[J]. Rare Metal Materials and Engineering,2010,39(9):1593~1597.]
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  • Received:September 15,2009
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