According to the application demand of novel integrated structural-functional materials for electronic packaging in electronic information industry, high-silicon aluminum alloys (50%-70%Si, mass fraction) were fabricated by a combination method of spray forming and hot compression. The microstructure, thermal-physical and mechanical properties were studied by optical microscopy, scanning electronic microscopy, hardness meter and Formastor-Digital equipment. The results show that the as-deposited microstructure of the spray-formed high-silicon aluminum alloy is fine and dispersive, and the primary silicon phases which are irregular distribute homogenously in the aluminum matrix. The appropriate hot compression process of the as-deposited preform can eliminate basically the porosities generated by spary-forming process to improve the relative density of the alloy. The spray-formed silicon aluminum alloys with hot compression process exhibit excellent thermal-physical properties and good mechanical performance, which is a new family of integrated structural-functional materials for electronic packaging.