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Investigation of Microstructure and Properties of Cu/WCu/Cu Thin Sheet
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    Abstract:

    In order to reduce defects and improve the mechanical and electrical properties of W-Cu thin sheet under pressure process, a new Cu/WCu/Cu ultra-thin sheet with three-layer sandwich structure was designed, and then the changes of microstructures and properties of two structure specimens in cold-rolling process were compared and analyzed. The results show that compared with conventional structure specimens, the surface Cu-coated layer of the sandwich structure specimen can clad the tungsten particles and fill the pores on the surface of the substrate, thus achieve surface modification; in rolling process, sandwich structure specimens have relatively fewer defects, and working hardening is not obvious, the tensile strength and electrical conductivity are better than that of conventional structure specimens.

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[Xiao Yang, Li Yunbo, Zhuo Mingchuan, Wang Zhe, Hou Zhanjie, Zhu Yubin. Investigation of Microstructure and Properties of Cu/WCu/Cu Thin Sheet[J]. Rare Metal Materials and Engineering,2012,41(7):1298~1301.]
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  • Received:July 24,2011
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