A new processing technique was proposed called High Power Pulsed Magnetron Sputtering-Plasma Ion Implantation & Deposition (HPPMS-PIID) based on High Power Pulsed Magnetron Sputtering (HPPMS) and Plasma-Based Ion Implantation & Deposition (PBII&D) processing. In this paper, CrN films were prepared by this technique and the surface morphologies, structure, composition and properties were studied compared with those of the CrN films fabricated by conventional HPPMS biased by DC–100 V and no bias. Once high voltage is applied, the film shows a smooth surface, very dense packed grains, and a discontinuous columnar structure. A highest intensity of CrN(200) preferential orientation and best adhesion were obtained by HPPMS-PIID due to the highly energetic ion implantation and bombardment. Compared with that of conventional HPPMS, high deposition rate was achieved in HPPMS-PIID since most ions were attracted into the sheath induced by negative high-voltage pulse, and consequently were deposited on the substrate.