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Fabrication of Diamond/copper Composites by Hot Isostatic Pressing
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Beijing Key Laboratory of Opto-electronic Functional Materials Micro-nano Devices,Department of Physics,Renmin University of China,Beijing,Beijing Key Laboratory of Opto-electronic Functional Materials Micro-nano Devices,Department of Physics,Renmin University of China,Beijing,Fujian Institute of Research on the Structure of Matter,Chinese Academy of Sciences,Fuzhou,Fujian,Fujian Institute of Research on the Structure of Matter,Chinese Academy of Sciences,Fuzhou,Fujian,Beijing Key Laboratory of Opto-electronic Functional Materials Micro-nano Devices,Department of Physics,Renmin University of China,Beijing,Beijing Key Laboratory of Opto-electronic Functional Materials Micro-nano Devices,Department of Physics,Renmin University of China,Beijing,Beijing Key Laboratory of Opto-electronic Functional Materials Micro-nano Devices,Department of Physics,Renmin University of China,Beijing

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TB333; TF124

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    Abstract:

    Diamond/copper composites were successfully fabricated by hot isostatic pressing(HIP) at a temperature of 900 ℃ and a pressure of 110 MPa for 1 h, and their microstructure and thermal properties were also studied. The results show that diamond particles are dispersed homogeneously in the copper matrix without evident graphitization. With increasing volume fraction of diamond, the relative density, thermal conductivity and coefficient of thermal expansion of the composites decrease. The maximum relative density and thermal conductivity of these samples are up to 98.5% and 305 W/mK, respectively. The diamond/copper composites prepared by HIP can achieve equal or even higher thermal conductivity than those fabricated by hot pressing(HP) and spark plasma sintering(SPS). Obviously, HIP shows great potential in preparing diamond/copper composites.

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[Wang Fangyu, Wang Wenchao, Shi Ming, Lin Yue, Guo Wang, Yuan Xuanyi, Cao Yongge. Fabrication of Diamond/copper Composites by Hot Isostatic Pressing[J]. Rare Metal Materials and Engineering,2017,46(3):853~856.]
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History
  • Received:January 09,2015
  • Revised:March 28,2015
  • Adopted:May 13,2015
  • Online: May 18,2017
  • Published: