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李琴,雷永平,符寒光,林健.Sn-Bi-In低温无铅钎料的组织和性能研究[J].稀有金属材料与工程(英文),2017,46(10):3038~3042.[Li Qin,Lei Yongping,Fu Hanguang and Lin Jian.Microstructures and Properties of Sn-Bi-In Low-temperature Lead-free Solders[J].Rare Metal Materials and Engineering,2017,46(10):3038~3042.]
Microstructures and Properties of Sn-Bi-In Low-temperature Lead-free Solders
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Received:June 16, 2015  Revised:July 21, 2015
DOI:
Key words: Sn-Bi-In  Microstructure  DSC curves  wettability  tensile strength
Foundation item:国家自然科学基金资助(项目号51275006,51005004,51475005);云南省对外科技合作计划(省院省校科技合作)(项目号2012IB003)和北京市自然科学基金重点项目(项目号KZ20110005002)
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Li Qin,Lei Yongping,Fu Hanguang and Lin Jian  
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Abstract:
      The characteristics of microstructures, thermal properties, wettabilities and mechanical properties of Sn-Bi-In solders with different content were studied. The results show that the microstructure of Sn-Bi-In solders consists of β-Sn, Bi and InBi phases, the reduction of Bi content can result in the proportion decrease of Bi and InBi phases. There are three endothermic peaks with different magnitudes on the DSC curves, and the onset melting temperature of solders are around 101.3-103.4℃, with the increase of Sn concentration, the melting range of solders firstly decreases and then increases, while the spreading area firstly increases and then decreases. The mircrohardness of solders increases with the rising of Bi conetent, in addition, the hardness is remarkably higher than Sn-Bi eutectic alloy when the In element is added to solder. The tensile strength and elongation of solders decrease with reduction of Bi content.
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