+Advanced Search
Influence of pulse parameters on the morphology and microstructure of gold electrodeposits
Affiliation:

China University of Geosciences Wuhan,China University of Geosciences Wuhan,China University of Geosciences Wuhan,China University of Geosciences Wuhan

  • Article
  • | |
  • Metrics
  • |
  • Reference [13]
  • |
  • Related [20]
  • |
  • Cited by
  • | |
  • Comments
    Abstract:

    Thick gold material was fabricated in cyanide-free chloroauric acid solution by bipolar pulse reverse technique, influence of forward and reverse current density and duty cycle on the morphology and microstructure of gold deposits were studied and discussed. Results showed that when forward current density increased from 2.25 A/dm2 to 3.75A/ dm2, grain sizes became smaller and gold particles stacked more compact, but overhigh forward current density lead to surface fluctuation and decreasing of gold deposits flatness; While when reverse current density increased from 6 A/ dm2 to 12A/ dm2, grains became larger and structure loosen. Cathodic overpotential would increase when forward duty cycle increased from 20% to 60%, thus refining the gold deposits,grain sizes became smaller, but cracks would appear if forward duty cycle increased too much; While pores appear and deposits grew thinner and became crisp gradually when reverse duty cycle increased from 10% to 40%. By calculating the texture coefficient, gold deposits showed a preferred orientation along (111) and (222) plain under higher cathodic overpotential; while(200)plain was preferred under lower cathodic overpotential.

    Reference
    [1]Xiang Guopu(向国朴). Development status of pulse current plating[J]. Electroplating Finishing(电镀与涂饰), 2000,S19(4): 43-47.
    [2] Mandich N V. Pulse and pulse-reverse electroplating[J]. Metal Finishing, 2000, 98(1): 375-380.
    [3] Liu Yong(刘勇), Luo Yihui(罗义辉), Wei Zidong(魏子栋) . Current Status of Pulse Plating Research[J]. Plating Finishing(电镀与精饰), 2005,S27(5): 25-29.
    [4] Liu Z, Zheng M, Hilty R D, et al. The effect of pulse reversal on morphology of cobalt hard gold[J]. Electrochimica Acta, 2011, 56(5): 2546-2551.
    [6] Yevtushenko O, Natter H, Hempelmann R. Influence of bath composition and deposition parameters on nanostructure and thermal stability of gold[J]. Journal of Solid State Electrochemistry, 2007, 11(2): 138-143.
    [7] Wu Caixia(吴彩霞), Zhang Chuncheng(张春成), Yang Jiangong(杨建功). Electroplating process for TO series tube socket. Electroplating Finishing(电镀与涂饰). 2001,S20(6): 36-38.
    [8] Watanabe H, Hayashi S, Honma H. Microbump formation by noncyanide gold electroplating[J]. Journal of the Electrochemical Society, 1999, 146(2): 574-579.
    [9] He A, Liu Q, Ivey D G. Electroplating of gold from a solution containing tri-ammonium citrate and sodium sulphite[J]. Journal of Materials Science: Materials in Electronics, 2009, 20(6): 543-550.
    [10] Zheng Lishan(郑利珊), Yuan Xinqiang(袁心强), Lei Ting(雷婷). Feasibility study of the application of bidirectional pulse power in gold electroforming process[J]. Gold(黄金), 2013,S(12): 4-8.
    [11] Gu Min(辜敏), Yang Fangzu(杨防祖), Huang Ling(黄令) et al. XRD Study on Highly Preferred Orientation Cu Electrodeposit[J]. Electrochemistry(电化学), 2002,S8(3): 282-287.
    [12]Li Di(李荻). Electrochemical Polarization(电化学原理)[M]. Beijing: Beijing University of Aeronautics and Aerospace Press, 2011:286-298
    [13]Wang Yu, Yuan Xuetao, Yu Hongying et al. Influence of pulse parameters on the microstructure andmicrohardness of nickel electrodeposits[J]. Materials Science Technology(材料科学与工艺), 2010,18(01): 89-95.
    [14]Lu Junfeng(卢俊峰). Non-Cyanide Silver Electroplating Using DMH as Complexing Agent and Investigation on Electrodeposition Behaviors[D]. Harbin Institute of Technology, 2007:60-61
    Cited by
Get Citation

[Lei Ting, Yuan Xinqiang, Wang Chengbo, Zheng Lishan. Influence of pulse parameters on the morphology and microstructure of gold electrodeposits[J]. Rare Metal Materials and Engineering,2016,45(5):1257~1263.]
DOI:[doi]

Copy
Article Metrics
  • Abstract:1847
  • PDF: 1440
  • HTML: 135
  • Cited by: 0
History
  • Received:June 16,2015
  • Revised:August 07,2015
  • Adopted:November 18,2015
  • Online: June 02,2016