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金艳婷,梁淑华.多孔结构阻挡层对CuW/Al界面组织及性能的影响[J].稀有金属材料与工程(英文),2017,46(10):2943~2949.[Jin Yanting and Liang Shuhua.Effect of porous structure barrier layer on microstructure and properties of CuW/Al interface[J].Rare Metal Materials and Engineering,2017,46(10):2943~2949.]
Effect of porous structure barrier layer on microstructure and properties of CuW/Al interface
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Received:July 15, 2015  Revised:April 22, 2016
DOI:
Key words: CuW/Al interface  Ni interlayer  Microstructure  Intermetallic compound
Foundation item:国家自然科学基金资助(项目号51371139)
Author NameAffiliation
Jin Yanting and Liang Shuhua  
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Abstract:
      A layer of W skeleton with 100-200μm was obtained by corroding the Cu of CuW surface. Then, a porous structure diffusion barrier layer was formed by electroless Ni plating on W skeleton. Finally, the CuW/Al bimetals was prepared by using solid-liquid connection at 700℃. The microstructure of interfacial diffusion layer at different holding time was investigated, and the precipitation sequence of the intermetallic compounds was analyzed. The results show that the porous structure Ni interlayer between CuW/Al interface can effectively reduce the amount of Al2Cu compounds, and prevent the formation of Kirkendall voids. The CuW/Al interface mainly consists of Al2Cu and Al5W phases. By adding porous structure Ni interlayer, the interface bonding property and electrical conductivity of CuW/Al were improved.
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