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齐艳飞,王波,周景一,李运刚,田薇.W-Ni-Cu功能梯度材料的制备及性能研究[J].稀有金属材料与工程(英文),2017,46(12):3893~3896.[QI Yanfei,WANG Bo,ZHOU Jingyi,LI Yungang and TIAN Wei.Study on the preparation and properties of W-Ni-Cu functionally gradient materials[J].Rare Metal Materials and Engineering,2017,46(12):3893~3896.]
Study on the preparation and properties of W-Ni-Cu functionally gradient materials
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Received:October 13, 2015  Revised:March 16, 2016
DOI:
Key words: W-Ni-Cu functional graded material  bonding properties  thermal conductivity
Foundation item:国家自然科学基金资助项目(51274082);ITER计划专项项目(2013GB109003)
Author NameAffiliation
QI Yanfei,WANG Bo,ZHOU Jingyi,LI Yungang and TIAN Wei  
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Abstract:
      W-Ni-Cu compound materials were?obtained?by?using?fused-salt?electrolysis?method?and?aqueous?solution?electrolysis?method. W-Ni-Cu?functional?graded?materials?(FGM)?characterized?with?different?thickness?(25 μm,?35 μm?and?45 μm) were obtained from its compound materials after annealing at?800 ℃ for?60min,?120min?and?180min, respectively, Ni plays a role in bridging Cu and W. Cracks and abscission were not presented?in?the?surface?of?samples?after?thermal?shock?and?thermal?fatigue,?which?indicates?the?material?has?good?bonding?properties. Thermal ?conductivity?tests?were?also?conducted,?the?result?shows?that?the?thermal?conductivity?of?pure?W?plate?and?W-Ni-Cu FGM decrease with increasing temperature (25~800 ℃). The thermal conductivity of pure W plate is higher than that of W-Ni-Cu FGM at the same temperature. The thermal conductivity of W-Ni-Cu FGM decreases with increasing gradient thickness.