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Study of Silicon on Microstructure, Mechanical Properties of Asymmetric Roll Bonded Cu/Al-Si Alloy Clads
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Key Laboratory of National Education Ministry for Electromagnetic Processing of Materials,Northeastern University,Key Laboratory of National Education Ministry for Electromagnetic Processing of Materials,Northeastern University,Key Laboratory of National Education Ministry for Electromagnetic Processing of Materials,Northeastern University,Key Laboratory of National Education Ministry for Electromagnetic Processing of Materials,Northeastern University

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    Abstract:

    Cu/Al-Si alloy clads were cold roll bonded with a mismatch speed ratio of 1.7 at ambient temperature, and uniform intermetallic compounds(IMCs) formed when these Cu/Al-Si alloy laminates with different silicon content were annealed at 400 ℃ for 30 minutes. With the utilizition of OM, SEM, EPMA, XRD, tensile machine and so on, it showed that the width of IMCs reached the maximum at 8.66%(wt.%) silicon content. With increase of silicon in Al-Si alloy, the tensile strength of laminated composites increased while elongation and peeling strength of composites went down, and their comprehensive properties reached the best at 4.84% with tensile strength and elongation of 188.63 MPa、39.1%, respectively. Meanwhile, fracture morphology of Cu/Al-Si alloy laminates in Cu side was ridge-like, and structure of Al-Si alloy in center region was mainly dimples, the more silicon content in Al-Si alloy, the more dimples appealed.

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[Liu Guoping, Wang Ping, Zhao Yingying, Chang Dongxu. Study of Silicon on Microstructure, Mechanical Properties of Asymmetric Roll Bonded Cu/Al-Si Alloy Clads[J]. Rare Metal Materials and Engineering,2018,47(1):223~228.]
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History
  • Received:November 08,2015
  • Revised:December 29,2015
  • Adopted:January 14,2016
  • Online: February 07,2018
  • Published: