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李小军,戴品强.RE及Ni对Zn20Sn高温无铅钎料显微组织及性能的影响[J].稀有金属材料与工程(英文),2018,47(6):1860~1865.[lixiaojun and Dai Pinqiang.The Influence of RE and Ni on the Microstructure and Properties of Zn20Sn High-temperature Lead-Free Solder[J].Rare Metal Materials and Engineering,2018,47(6):1860~1865.]
The Influence of RE and Ni on the Microstructure and Properties of Zn20Sn High-temperature Lead-Free Solder
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Received:May 19, 2016  Revised:July 01, 2016
DOI:
Key words: lead-free solder  Zn20Sn  microstructure  properties
Foundation item:福建省科技厅资助项目(2015H0008)
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lixiaojun and Dai Pinqiang  
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Abstract:
      0.1wt.% RE and 0.2~0.8wt.% Ni were added into the Zn20Sn high-temperature lead-free solder. The effects of RE and Ni additions on the microstructure and properties of the solder alloys were investigated. The results show that the solidus temperature of solder alloys is not distinctly affected when the 0.1 wt.% RE and 0.2%~0.8wt.% Ni were added into Zn20Sn solder alloys, whereas the liquidus temperature is decreased, the wettability and microhardness are significantly improved. The solder alloy shows best wettability and highest microhardness when the content of RE is 0.1wt.% and Ni is 0.4wt.%. Ni-containing intermetallic compounds formed in solder alloys and the amount of intermetallic compounds gradually increaseed with increasing Ni content, and the shape of intermetallic compounds and the microstructure of solder alloys are significantly changed.