0.1wt.% RE and 0.2~0.8wt.% Ni were added into the Zn20Sn high-temperature lead-free solder. The effects of RE and Ni additions on the microstructure and properties of the solder alloys were investigated. The results show that the solidus temperature of solder alloys is not distinctly affected when the 0.1 wt.% RE and 0.2%~0.8wt.% Ni were added into Zn20Sn solder alloys, whereas the liquidus temperature is decreased, the wettability and microhardness are significantly improved. The solder alloy shows best wettability and highest microhardness when the content of RE is 0.1wt.% and Ni is 0.4wt.%. Ni-containing intermetallic compounds formed in solder alloys and the amount of intermetallic compounds gradually increaseed with increasing Ni content, and the shape of intermetallic compounds and the microstructure of solder alloys are significantly changed.