Quick Search:       Advanced Search
俞伟元,高盟召,张天宇,尚江旭,颜泽华.超声波辅助钎焊镁铝异种金属接头微观组织研究[J].稀有金属材料与工程(英文),2018,47(10):3197~3202.[Yu weiyuan,Gao Mengzhao,Zhang Tianyu,Shang Jiangxu and Yan Zehua.Study on microstructure of Ultrasonic-assisted brazing Mg/Al dissimilar metal joints[J].Rare Metal Materials and Engineering,2018,47(10):3197~3202.]
Study on microstructure of Ultrasonic-assisted brazing Mg/Al dissimilar metal joints
Download Pdf  View/Add Comment  Download reader
Received:January 11, 2017  Revised:August 30, 2018
DOI:
Key words: Mg alloy  Al alloy  brazing  ultrasonic-assisted
Foundation item:国家自然科学基金资助(项目号51465032), 甘肃省有色金属先进加工与再利用国家重点实验室开放基金资助
Author NameAffiliation
Yu weiyuan,Gao Mengzhao,Zhang Tianyu,Shang Jiangxu and Yan Zehua  
Hits: 30
Download times: 6
Abstract:
      Al alloy and Mg alloy, which have advantages of low density and high specific strength, are widely applied in aerospace industry, yet easily generate brittle intermetallic compound during welding, thereby causing great difficulty in acquisition of joints with excellent performance. Therefore, during soldering, choose of soldering filler metal which can avoid generation of harmful intermetallic compound is key to acquisition of high grade Al/Mg dissimilar metal joint. In this work, Sn-based and Zn-based soldering filling metals are chosen, 6063 Al alloy and AZ31B Mg alloy are welded by ultrasonic-assisted soldering at atmosphere, and contrastive analysis is carried out to the two solder joint microstructures of soldering filler metals by OM, SEM and EDS spectrum. The results indicated that when Sn-based soldering filler metal is adopted, the joint cannot generate Mg-Al brittle intermetallic compound, Al elements which dissolve in soldering seams exist in the joint in form of Al-Sn-Zn and Ag (Al) phases, and when the ultrasonic action time reaches 4.5s, the Al elements are uniformly distributed in the whole soldering seam. When Zn-based soldering filler metal is adopted, large amount of brittle Mg/Al intermetallic compound generate in the joint, and second-phased low-melting-point Sn particles disperse at the grain boundary of the soldering seam.