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王 博,薛松柏,王俭辛,龙伟民,张青科.稀土Pr对低银Sn-0.3Ag-0.7Cu-0.5Ga钎料蠕变行为影响的研究[J].稀有金属材料与工程(英文),2018,47(9):2657~2662.[Wang Bo,Xue Songbai,Wang Jianxin,Long Weimin and Zhang Qingke.Study on creep behavior of Sn-0.3Ag-0.7Cu-0.5Ga low-Ag solder alloys bearing Pr[J].Rare Metal Materials and Engineering,2018,47(9):2657~2662.]
Study on creep behavior of Sn-0.3Ag-0.7Cu-0.5Ga low-Ag solder alloys bearing Pr
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Received:February 10, 2017  Revised:March 02, 2017
Key words: rare earth Pr  Sn-Ag-Cu-Ga solder  creep behavior  microstructure
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Wang Bo,Xue Songbai,Wang Jianxin,Long Weimin and Zhang Qingke  
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      For development of low-Ag lead free solder alloys for microelectronic packaging, the correlation of creep properties with microstructure of novel Sn-0.3Ag-0.7Cu-0.5Ga (SAC-Ga) solder alloys bearing Pr has been investigated using nanoindentation. The results show that the creep deformation of SAC-Ga, SAC-Ga-0.06Pr, SAC-Ga-0.5Pr is 1717 nm, 1144 nm,1472 nm, respectively, which indicates that Pr addition could significantly enhance the creep resistance of SAC-Ga solders due to the refinement and more uniform distribution of Cu6Sn5 intermetallic compounds (IMCs). However, compared with the SAC-Ga-0.06Pr solder alloy, the SAC-Ga-0.5Pr alloy shows lower creep resistance which is mainly attributable to the surface oxidation of excess rare earth Pr. In addition, Dorn model has been used to describe the creep behavior and to obtain stress exponents of the SAC-Ga solder alloys bearing Pr. It is proposed that strengthening mechanism of creep resistance in SAC-Ga solder alloys bearing Pr is that when encountering refined and well-distributed Cu6Sn5 IMCs, a dislocation line cannot climb through the IMCs but bypass the IMCs, leading to a decrease in the creep deformation of the solder alloys bearing Pr.