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崔建国,张柯柯,赵迪,马宁,曹聪聪,潘毅博.外能辅助下Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu钎焊接头组织与性能[J].稀有金属材料与工程(英文),2018,47(9):2800~2806.[Cui Jianguo,Zhang Keke,Zhao Di,Ma Ning,Cao Congcong and Pan Yibo.Microstructure and properties of Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints obtained by external energy assisted soldering[J].Rare Metal Materials and Engineering,2018,47(9):2800~2806.]
Microstructure and properties of Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints obtained by external energy assisted soldering
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Received:November 27, 2017  Revised:March 01, 2018
DOI:
Key words: Sn2.5Ag0.7Cu0.1RE0.05Ni solder  USW-E external energy  soldering joint  microstructure  properties
Foundation item:国家自然科学基金资助项目(U1604132);国家国际科技合作专项(2014DFR50820);河南省科技创新杰出人才计划(154200510022);河南省创新型科技团队
Author NameAffiliation
Cui Jianguo,Zhang Keke,Zhao Di,Ma Ning,Cao Congcong and Pan Yibo  
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Abstract:
      Abstract: The Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints were fabricated by the ultrasionc wave (USW) and the electric field (E) assisted soldering technique. The microstructure and mechanical properties of solder joints were analyzed by the scanning electron microscope (SEM), the energy dispersive spectrometer (EDS) and the X-ray diffraction (XRD). The Results showed that the USW or the USW-E have great influence on the microstructure of the solder joints. The USW or the USW-E assisted soldering technique not only can refine microstructure of the Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints and promote the proportion of eutectic structure, but also can reduce the average thickness, the roughness and the grain size of interfacial IMC. The shear strength of the Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu soldering joints under the USW-E assisted soldering is closely related to the roughness of interfacial IMC layer. The USW played an important role in the decrease of the roughness of the interfacial IMC during the USW-E assited soldering. Compared with shear strength of the traditional soldering joints, a 24.1% increase of shear strength of the soldering joints was achieved with the USW-E assisted soldering. With applying the USW or the USW-E, the fracture path of the Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu soldering joints was transferred from the interfacial transitional region composed of soldering seam and interfacial IMC layer to the side of soldering seam. The fracture mechanism of the soldering joints obtained by the USW or the USW-E assisted soldering was brittle-ductile mixed fracture with the cleavage of interfacial (Cu, Ni)6Sn5 IMC and the cleavage-dimple of soldering seam, which increased the proportion of ductile fracture zone and the shear strength of soldering joints.