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刘兴军,朱家华,何洲峰,张锦彬,杨水源,韩佳甲,卢勇,王翠萍.热压烧结制备CuFeCoCr复合材料的显微组织及热物理性能研究[J].稀有金属材料与工程(英文),2020,49(2):422~428.[Xingjun Liu,Jiahua Zhu,Zhoufeng He,Jinbin Zhang,Shuiyuan Yang,Jiajia Han,Yong Lu and Cuiping Wang.Investigation of microstructure and thermophysical properties of hot-pressed CuFeCoCr composite[J].Rare Metal Materials and Engineering,2020,49(2):422~428.]
Investigation of microstructure and thermophysical properties of hot-pressed CuFeCoCr composite
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Received:September 13, 2018  Revised:October 04, 2018
DOI:
Key words: CALPHAD approach  Composites  Liquid phase separation  Thermal expansion coefficients  Thermal conductivity
Foundation item:国家自然科学基金项目(面上项目,项目号:51471138)
Author NameAffiliation
Xingjun Liu,Jiahua Zhu,Zhoufeng He,Jinbin Zhang,Shuiyuan Yang,Jiajia Han,Yong Lu and Cuiping Wang  
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Abstract:
      In this paper, series micro-scale powders with composite microstructure in CuFeCoCr system were successfully designed and fabricated by using CALPHAD (Calculated of Phase Diagrams) approach and gas atomization method, respectively. The bulk CuFeCoCr composites were produced by hot pressing technique at 950℃ under a pressure of 45MPa. The effect of Cu content on the microstructure, coefficients of thermal expansion (CTE), thermal conductivity (TC) and micro-hardness (HV) were systematically studied. The results show that the CuFeCoCr composites present two separate fcc phases (Cu-rich and FeCrCo-rich phase) microstructure. After annealing at 500 °C for 8 h, the CTE of the composites ranged from 5.75 to 11.45×10-6 K-1 and TC varied from 42.2 to 107.4 W.m-1.K-1. Particularly, the Cu55(Fe0.37Cr0.09Co0.54)45 composite exhibits excellent comprehensive properties, i.e. CTE of 6.88×10-6 K-1 and TC of 91.09 W.m-1.K-1,which matches with the semiconductor in electronic packaging. In addition, all the prepared composites exhibit a higher HV than that of Cu/Invar composite.