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张建宇,陈庆安,王艳辉,李河宗,吴春京.Cu/Al复合材料高温短时退火的组织与性能演变研究[J].稀有金属材料与工程(英文),2019,48(7):2193~2202.[Zhang Jianyu,Chen Qingan,Wang Yanhui,Li Hezong and Wu Chunjing.Study on microstructure and property evolution of Cu/Al composite during high-temperature short-time annealing[J].Rare Metal Materials and Engineering,2019,48(7):2193~2202.]
Study on microstructure and property evolution of Cu/Al composite during high-temperature short-time annealing
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Received:October 19, 2018  Revised:November 14, 2018
Key words: Cu/Al composite  annealing  high-temperature short-time  nucleation kinetics  intermetallic comound thickness
Foundation item:国家自然科学基金资助(项目号51274038);河北省高等学校科学技术研究项目(QN2018078)
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Zhang Jianyu,Chen Qingan,Wang Yanhui,Li Hezong and Wu Chunjing  
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      The cold-rolled Cu/Al laminated composite was annealed at 475-525℃ for 1-8min, the temperature field of Cu/Al composite during annealing was simulated using finite element software, and the microstructures and properties of Cu/Al composite were investigated by scanning electron microscopy(SEM), energy dispersive X-ray spectrometry(EDS), X-ray diffractometer(XRD), electron back-scattered diffraction(EBSD) and microhardness tester. The results indicated that three intermetallic compounds (IMCs), CuAl<sub>2</sub> ,Cu<sub>9</sub>Al<sub>4</sub> and CuAl phases formed successively at the Cu/Al interface, complete recrystallization of both the Cu and Al matrix took place to form equixed grain, within the annealing process scope in which the thickness of IMCs layer is smaller than 4μm, the microhardness of Cu and Al matrix drops fast to approach that of annealing at 350℃ for 1h.Therefore, the high-temperature short-time annealing process could substitute for low-temperature long-time annealing process. Furthermore,the nucleation mechanism of primary phase was proposed and the kinetics of IMCs during high-temperature short-time was analytized and calculated, and an empirical numerical method was proposed to calculate the thickness of IMCs during the non-isothermal annealing process.