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李阳,魏志坚,徐平伟,梁益龙,梁宇.热变形对GH4169合金中NbC析出相尺寸形貌影响研究[J].稀有金属材料与工程(英文),2020,49(5):1773~1780.[Yang Li,Zhi-jian Wei,Ping-wei Xu,Yi-long Liang and Yu Liang.Effect of Thermal Deformation on Size and Morphology of NbC Precipitates in GH4169 Alloy[J].Rare Metal Materials and Engineering,2020,49(5):1773~1780.]
Effect of Thermal Deformation on Size and Morphology of NbC Precipitates in GH4169 Alloy
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Received:March 26, 2019  Revised:May 21, 2019
DOI:
Key words: GH4169 superalloy  thermal deformation  NbC  size  distribution
Foundation item:国家自然科学基金资助(项目号51761003)
Author NameAffiliation
Yang Li,Zhi-jian Wei,Ping-wei Xu,Yi-long Liang and Yu Liang  
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Abstract:
      The thermal compression test was carried out by Gleeble 3500 thermal simulator and combined with microstructure observation and statistical analysis to study the effect of thermal deformation on the size and distribution characteristics of NbC particles in GH4169 alloy. Studies have shown that the adiabatic effect during compression leads to a further increase in the core temperature of the sample, thus providing conditions for NbC re-dissolution during the deformation process. The high dislocation density region formed by the NbC particles and the matrix during the deformation process promotes the diffusion of the elements and accelerates the remelting and passivation of the sharp corner regions with small radii of curvature. With the increase of deformation, the NbC remelting tendency increased, and the average size and volume fraction showed a decreasing trend. During the deformation process, the metal flow promotes the displacement of the NbC particles. Under the 70% deformation amount, the average spacing of the NbC particles increases significantly higher than the 30% and 50% deformation samples. Therefore, with the increase of deformation, the NbC particles have a distribution characteristic from chain→chain bending→chain direction→dispersion distribution, which promotes the fine and diffuse distribution of the original chain NbC in the matrix. The results provide a direct reference for the improvement of GH4169 flash soldering performance.