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孙学敏,俞伟元,吴保磊,杨国庆,刘赟.直流电作用下铜在液态锡里的溶解动力学[J].稀有金属材料与工程(英文),2020,49(10):3425~3432.[Sun Xuemin,Yu Weiyuan,Wu Baolei,Yang Guoqing and Liu Yun.Kinetics of Copper Dissolution in Liquid Tin by Direct Current[J].Rare Metal Materials and Engineering,2020,49(10):3425~3432.]
Kinetics of Copper Dissolution in Liquid Tin by Direct Current
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Received:October 19, 2019  Revised:November 09, 2019
Key words: Electromigration  Dissolution  Activation energy  Effective charge
Foundation item:国家自然科学基金资助(项目号51465032)
Author NameAffiliation
Sun Xuemin,Yu Weiyuan,Wu Baolei,Yang Guoqing and Liu Yun  
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      In this article, the dissolution kinetics of copper in liquid Tin at temperatures in the range 513~573 K were investigated under the influence of a DC current by immersion method. After dissolution, the dissolution thickness and the thickness of IMC layer at Sn/Cu interface were measured and the dissolution activation energy and effective charge Z* were calculated. It is found that the current had a marked effect on the dissolution rate constant. Correspondingly, the application of the current significantly decreased the activation energy of dissolution. Similarly,the direction of the DC current was shown to have an effect on dissolution and the growth of IMC. When the electronic flow was in the direction of dissolution, a further increase in dissolution and a decrease in growth of IMC layer were observed and attributed to electromigration. When the current density was 240 A/cm2, the effective charge Z* decreased with the increased of temperature.