Rigid restraint thermal self-compressing bonding (TSCB) by localized induction heating, a new diffusion bonding technology was proposed in this paper. Experiments were conducted on Ti6Al4V plates to prove the feasibility of rigid restraint thermal self-compressing bonding by local induction heating. Moreover, finite element analysis was employed to numerically investigate the thermal elastic-plastic stress-strain cycle during thermal self-compressing bonding by localized induction heating. Results show that solid-state joint with homogeneous microstructure and excellent mechanical properties was attained. By localized induction heating, an internal elasto-plastic stress-strain field is developed which makes the bond interface subjected to thermal compressive action. This thermal self-compressing action combined with the high temperature on the bond interface promotes the atom diffusion across the bond interface to produce solid-state joints.