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姜楠,张亮,孙磊,王凤江,龙伟民,钟素娟.热循环对Sn58Bi(纳米Ti)/Cu焊点界面与性能影响[J].稀有金属材料与工程(英文),2021,50(1):327~332.[Jiang Nan,Zhang Liang,Sun Lei,Wang Fengjiang,Long Weimin and Zhong Sujuan.Effect of thermal cycling on interface and properties of Sn58Bi(nano Ti)/Cu solder joints[J].Rare Metal Materials and Engineering,2021,50(1):327~332.]
Effect of thermal cycling on interface and properties of Sn58Bi(nano Ti)/Cu solder joints
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Received:February 10, 2020  
DOI:
Key words: Sn58Bi solder  Ti nanoparticles  interfacial reaction  thermal cycle  diffusion coefficient
Foundation item:国家自然科学基金资助项目(51475220);先进焊接与连接国家重点实验室开放课题重点项目(AWJ-19Z04);江苏省“六大人才高峰”资助项目(XCL-022)
Author NameAffiliation
Jiang Nan,Zhang Liang,Sun Lei,Wang Fengjiang,Long Weimin and Zhong Sujuan  
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Abstract:
      In order to improve the performance of Sn-58Bi lead-free solder, the Sn-58Bi-0.1Ti nanometer reinforced composite solder was prepared by incorporating 0.1% Ti nanoparticles into the Sn-58Bi solder. In this paper, the effect of adding Ti nanoparticles on the growth behavior of intermetallic compounds (IMC) in Sn-58Bi/Cu solder joints during thermal cycling was studied. The results showed that a scallop-like Cu6Sn5 IMC layer was formed at Sn-58Bi /Cu and Sn-58Bi-0.1Ti/Cu interface after reflow soldering. After 300 thermal cycles, a layer of Cu3Sn IMC was formed at the Cu6Sn5/Cu interface. The thickness of IMC layer of Sn-58Bi/Cu solder joint and Sn-58Bi-0.1Ti/Cu solder joint is proportional to the square of thermal cycling time. However, the IMC thickness of Sn-58Bi-0.1Ti/Cu solder joint is significantly lower than that of Sn-58B/Cu solder joint, which indicated that the addition of Ti nanoparticles can effectively inhibit the excessive growth of interfacial IMC during the thermal cycle process. In addition, the IMC layer diffusion coefficients of these two solder joints were calculated, and it was found that the diffusion coefficients of IMC layer in Sn-58Bi-0.1Ti/Cu solder joint (overall IMC, Cu6Sn5 and Cu3Sn IMC) were smaller than that of Sn-58Bi/Cu solder joint, which explained the inhibitory effect of Ti nanoparticles on the interface IMC layer to some extent.