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[wangshun,wangyang,zhangyuanxiang,fangfeng,ranrong and yuanguo.Compression Bonding Behavior and Interfacial Microstructural Evolution of GH4169 Superalloy[J].Rare Metal Materials and Engineering,2022,51(8):2794~2801.]
Compression Bonding Behavior and Interfacial Microstructural Evolution of GH4169 Superalloy
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Received:July 03, 2021  Revised:August 05, 2021
Key words: GH4169 superalloy  hot compression bonding  deformation behavior  interfacial microstructure
Foundation item:the Fundamental Research Funds for the Central Universities (N2107001), the China Postdoctoral Science Foundation (2019M651129, 2019TQ0053) and the National Natural Science Foundation of China (52001060)
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wangshun,wangyang,zhangyuanxiang,fangfeng,ranrong and yuanguo  
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      In order to simulate the hot-rolling composite technology of GH4169 superalloy, the hot isothermal compression bonding tests were performed on an MSS-200 thermal simulator in the temperature range of 900 °C to 1100 °C and at strain rates of 1~10 s-1. The Arrhenius type constitutive equation and the hot processing map were established to describe the deformation behavior of GH4169 superalloy during the compression bonding. Furthermore, the corresponding thermal deformation activation energy Q and the stress index n were calculated as 320.33 kJ·mol-1 and 4.1573, respectively. Additionally, the bonding interfaces were observed by optical microscope (OM) and electron backscatter diffraction (EBSD) technique. The results show that the bonding interface is mainly affected by the technological parameters, and the bonding interface becomes almost invisible at 1100 °C with a rate of 10 s-1.