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Molecular dynamics simulation of tensile deformation behavior of monocrystalline Ni and its alloys with different stacking fault energies
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1.School of Material Science and Engineering,Lanzhou University of Technology;2.School of Mechanical Engineering,Lanzhou Petrochemical University of Vocational Technology

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    Abstract:

    Molecular dynamics simulation was used to simulate the uniaxial tensile deformation of monocrystalline Ni and Ni57Cr19Co19Al5 alloy models with different cross-sectional sizes in the [100] orientation, the appropriate simulation modle size with stable plastic flow stress was determined. The tensile deformation behavior of monocrystalline Ni and its alloys of the same modle with stable flow stress were further studied. The results show that the monocrystalline Ni57Cr19Co19Al5 alloy with smaller modle sizes are likely to form multi-layer twins or deformation twins during the tensile process because of low stacking fault energy. As the cross-sectional side length of modle is greater than 30 times of lattice constant, the flow stress, phase structures and dislocation density in the plastic flow stage tend to be stable fluctuation with the variation of strain. When the monocrystalline Ni and Ni-based alloys with same modle of stable flow stress stage are stretched, the lower the stacking fault energy is, the larger the area of the stacking faults plane during plastic deformation. During the tensile process of monocrystalline Ni and Ni-based alloys, Shockley partials play a leading role in the plastic deformation process. The formation of multi-layer twins is accompanied by dislocation exhaustion, while the formation and annihilation of deformation twins are mainly dominated by the dislocation starvation mechanism.

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[Chen Jianjun, Ding Yutian, Ma Yuanjun, Gao Yunbi, Wang Xingmao. Molecular dynamics simulation of tensile deformation behavior of monocrystalline Ni and its alloys with different stacking fault energies[J]. Rare Metal Materials and Engineering,2023,52(9):3186~3197.]
DOI:10.12442/j. issn.1002-185X.20220731

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History
  • Received:September 13,2022
  • Revised:February 03,2023
  • Adopted:February 14,2023
  • Online: September 25,2023
  • Published: September 21,2023