高温、高应变率下Ti6321合金的力学行为及本构模型
DOI:
作者:
作者单位:

作者简介:

通讯作者:

中图分类号:

基金项目:

爆炸科学与技术国家重点实验室基金资助项目(YBKT17-06)


Mechanical Behavior and Constitutive Model of Ti6321 Alloy under High Temperature and High Strain Rate
Author:
Affiliation:

Fund Project:

  • 摘要
  • |
  • 图/表
  • |
  • 访问统计
  • |
  • 参考文献
  • |
  • 相似文献
  • |
  • 引证文献
  • |
  • 资源附件
  • |
  • 文章评论
    摘要:

    为了研究Ti6321合金在高温、高应变率下的力学行为,采用分离式霍普金森压杆装置对Ti6321合金进行室温(25℃)和高温(200、400、600℃)动态压缩试验,对其在高温和高应变率下的力学性能、应变率敏感性和温度敏感性进行了研究。采用聚类全局优化算法构建了双态组织Ti6321合金在103s-1下的Johnson-Cook本构模型。结果表明,双态组织Ti6321合金在室温和高温下均存在应变率硬化效应,但试验温度对流变应力的影响比应变率的影响更大。随着压缩试验温度升高,流变应力显著降低,温度敏感因子升高。Johnson-Cook模型拟合的曲线与实验曲线吻合良好,可以用于Ti6321合金高应变率下的力学仿真计算。

    Abstract:

    In order to study the mechanical behavior of Ti6321 alloy under high temperature and high strain rate,the dynamic compression behavior of Ti6321 alloy at room temperature( 25 ℃) and high temperature( 200,400,600 ℃)was investigated using a Split Hopkinson Pressure Bar. The mechanical properties,strain rate sensitivity and temperature sensitivity under high temperature and high strain rate were studied. A clustering global optimization algorithm was used to construct the Johnson-Cook constitutive model of Ti6321 alloy with bimodal microstructure under the strain rate of 103 s-1. The results demonstrate that Ti6321 alloy has a strain rate hardening effect both at room temperature and high temperature,but the effect of strain rate on flow stress is not as obvious as that of test temperature. As the test temperature increases,the flow stress decreases significantly,and the temperature sensitivity factor increases. The curve fitted by the Johnson-Cook constitutive model is in good agreement with the experimental curve,and the model can be used for mechanical simulation of Ti6321 alloy at high strain rates.

    参考文献
    相似文献
    引证文献
引用本文

周哲;王琳;安瑞;赵平洛;徐雪峰;宁子轩;程焕武;程兴旺;.高温、高应变率下Ti6321合金的力学行为及本构模型[J].钛工业进展,2020,37(5):1-6.

复制
分享
文章指标
  • 点击次数:
  • 下载次数:
  • HTML阅读次数:
  • 引用次数:
历史
  • 收稿日期:
  • 最后修改日期:
  • 录用日期:
  • 在线发布日期: 2020-11-09
  • 出版日期: 2020-10-25